Surface Technologies
Advanced Coatings
Semiconductor Chemical Vapor Deposition (CVD) and etch applications often use Fluorine-based compounds that are activated by remote or in-situ plasma treatment as part of the process or cleaning recipe. These hostile chemistries react with aluminum components such as pedestals and showerheads inside the process cavity. If the surface of the aluminum part is not passivated properly, this reaction will continue unabated forming an unstable layer that will result in flaking and defects on wafer.
TARA TECHNOLOGIES has developed a proprietary process that passivates an aluminum surface more effectively than the competition, thereby extending the service life of the component.
Feature Benefits
- Conformal Plasma Enhanced CVD films / CVD AlF
- Other films available upon request
- Ultra clean, Class 100 and 1000 clean room MFG
Applications
- Fluorine passivation/protection (AlF)
Markets
- Semiconductor Equipment